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Intel Pentium G6950, Intel Pentium G, LGA 1156, PC, 32 nm, 2.8 GHz, G6950
- Processor base frequency
- 2.8 GHz
- Tcase
- 72.6 °C
- Grafiikka ja IMC Die -koko
- 114 mm²
- Processor model
- G6950
- Processor cores
- 2
- Processor lithography
- 32 nm
- Processor threads
- 2
- System bus rate
- 2.5 GT/s
- Processor socket
- LGA 1156 (Socket H)
- Processor operating modes
- 64-bit
- Bus type
- DMI
- Thermal Design Power (TDP)
- 73 W
- Maximum number of PCI Express lanes
- 16
- PCI Express slots version
- 2.0
- Processor family
- Intel Pentium G
- PCI Express configurations
- 1x16,2x8
- VID Voltage Range
- 0.6500 - 1.4000 V
- Intel® Virtualization Technology (Intel® VT)
- VT-x
- Component for
- PC
- On-board graphics adapter base frequency
- 553 MHz
- Box
- N
- L3 cache speed
- 2.8 GHz
- Enhanced Intel SpeedStep Technology
- Y
- Intel VT-x with Extended Page Tables (EPT)
- Y
- Execute Disable Bit
- Y
- Idle States
- Y
- Processor package size
- 37.5 mm
- CPU configuration (max)
- 1
- Embedded options available
- Y
- Graphics & IMC lithography
- 45 nm
- Intel Virtualization Technology (VT-x)
- Y
- Intel FDI Technology
- Y
- Maximum internal memory supported by processor
- 16 GB
- Memory types supported by processor
- DDR3-SDRAM
- Memory clock speeds supported by processor
- 1066 MHz
- Memory bandwidth supported by processor (max)
- 17 GB/s
- Memory channels
- Dual-channel
- Number of displays supported (on-board graphics)
- 2
- Processor cache
- 3 MB
- Processor cache type
- L3
- Processing Die size
- 81 mm²
- Number of Processing Die Transistors
- 382 M
- On-board graphics adapter
- Y
- Intel® Smart Cache
- Y
- Compatible chipsets
- Intel® 3450, Intel® H55 Express, Intel® H57 Express, Intel® P55 Express, Intel® Q57 Express
- Number of Graphics & IMC Die Transistors
- 177 M
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Processor | |
---|---|
Processor family | Intel Pentium G |
Processor cores | 2 |
Processor socket | LGA 1156 (Socket H) |
Component for | PC |
Processor lithography | 32 nm |
Box | ![]() |
Processor base frequency | 2.8 GHz |
Processor model | G6950 |
Processor operating modes | 64-bit |
Processor threads | 2 |
System bus rate | 2.5 GT/s |
Processor cache | 3 MB |
Processor cache type | L3 |
L3 cache speed | 2.8 GHz |
Thermal Design Power (TDP) | 73 W |
VID Voltage Range | 0.6500 - 1.4000 V |
Compatible chipsets | Intel® 3450, Intel® H55 Express, Intel® H57 Express, Intel® P55 Express, Intel® Q57 Express |
Bus type | DMI |
Memory bandwidth supported by processor (max) | 17 GB/s |
Memory | |
Memory channels | Dual-channel |
Maximum internal memory supported by processor | 16 GB |
Memory types supported by processor | DDR3-SDRAM |
Memory clock speeds supported by processor | 1066 MHz |
Weight & dimensions | |
Processor package size | 37.5 mm |
Operational conditions | |
Tcase | 72.6 °C |
Other features | |
Intel® Virtualization Technology (Intel® VT) | VT-x |
Graphics | |
On-board graphics adapter | ![]() |
On-board graphics adapter base frequency | 553 MHz |
Number of displays supported (on-board graphics) | 2 |
Processor special features | |
Intel FDI Technology | ![]() |
Intel® Smart Cache | ![]() |
Enhanced Intel SpeedStep Technology | ![]() |
Intel VT-x with Extended Page Tables (EPT) | ![]() |
Intel Virtualization Technology (VT-x) | ![]() |
Features | |
Execute Disable Bit | ![]() |
Idle States | ![]() |
Maximum number of PCI Express lanes | 16 |
PCI Express slots version | 2.0 |
PCI Express configurations | 1x16,2x8 |
Number of Processing Die Transistors | 382 M |
Processing Die size | 81 mm² |
Number of Graphics & IMC Die Transistors | 177 M |
Grafiikka ja IMC Die -koko | 114 mm² |
CPU configuration (max) | 1 |
Embedded options available | ![]() |
Graphics & IMC lithography | 45 nm |