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Intel Core i9-10900F processor 2.8 GHz 20 MB Smart Cache
Core i9-10900F, 10th gen ® Core™ i9, LGA 1200, PC, 14 nm, , 2.8 GHz
INTEL Core I9-10900F 2.8GHz LGA1200 20M Cache Boxed CPU
- Intel® Turbo Boost Technology 2.0 frequency
- 5 GHz
- Intel® Turbo Boost Max Technology 3.0 frequency
- 5.1 GHz
- Intel® Thermal Velocity Boost Temperature
- 70 °C
- Intel® Thermal Velocity Boost Frequency
- 5.2 GHz
- Intel® Transactional Synchronization Extensions
- N
- Processor base frequency
- 2.8 GHz
- Launch date
- Q2'20
- Maximum memory
- 128 GB
- Generation
- 10th Generation
- Processor manufacturer
- Intel
- Processor model
- i9-10900F
- Processor cores
- 10
- Processor lithography
- 14 nm
- Intel® Boot Guard
- Y
- Intel® Hyper Threading Technology (Intel® HT Technology)
- Y
- Intel® Thermal Velocity Boost
- Y
- Product type
- Processor
- Processor threads
- 20
- System bus rate
- 8 GT/s
- Processor socket
- LGA 1200 (Socket H5)
- Package type
- Retail box
- Processor operating modes
- 64-bit
- Processor codename
- Comet Lake
- Thermal Design Power (TDP)
- 65 W
- Tjunction
- 100 °C
- Maximum number of PCI Express lanes
- 16
- PCI Express slots version
- 3.0
- Processor family
- 10th gen Intel® Core™ i9
- PCI Express configurations
- 1x16,2x8,1x8+2x4
- Intel® vPro™ Platform Eligibility
- N
- Component for
- PC
- ECC
- N
- Box
- N
- Cooler included
- Y
- Intel Turbo Boost Max Technology 3.0
- Y
- Intel® Identity Protection Technology (Intel® IPT)
- Y
- Status
- Launched
- Enhanced Intel SpeedStep Technology
- Y
- Intel® AES New Instructions (Intel® AES-NI)
- Y
- Intel Trusted Execution Technology
- N
- Intel VT-x with Extended Page Tables (EPT)
- Y
- Intel 64
- Y
- Execute Disable Bit
- Y
- Idle States
- Y
- Thermal Monitoring Technologies
- Y
- Processor package size
- 37.5mm x 37.5mm
- PCI Express CEM revision
- 3.0
- Supported instruction sets
- SSE4.1,SSE4.2,AVX 2.0
- Harmonized System (HS) code
- 8542310001
- CPU configuration (max)
- 1
- Target market
- Gaming, Content Creation
- Embedded options available
- N
- Intel Virtualization Technology for Directed I/O (VT-d)
- Y
- Tavaraluokituksen automaattinen seurantajärjestelmä (CCATS)
- G077159
- Intel Virtualization Technology (VT-x)
- Y
- Processor ARK ID
- 199329
- Maximum internal memory supported by processor
- 128 GB
- Memory types supported by processor
- DDR4-SDRAM
- Memory clock speeds supported by processor
- 2933 MHz
- Memory bandwidth supported by processor (max)
- 45.8 GB/s
- Memory channels
- Dual-channel
- Processor boost frequency
- 5.2 GHz
- Processor cache
- 20480 KB
- Processor cache type
- Smart Cache
- Maximum internal memory
- 128 GB
- Intel Stable Image Platform Program (SIPP)
- N
- Intel® Secure Key
- Y
- Intel® OS Guard
- Y
- Intel Software Guard Extensions (Intel SGX)
- Y
- Scalability
- 1S
- On-board graphics adapter
- N
- Thermal solution specification
- PCG 2015C
- Discrete graphics adapter
- N
- Intel® Optane™ Memory Ready
- Y
- Discrete graphics adapter model
- Not available
- On-board graphics adapter model
- Not available
- Intel® Turbo Boost Technology
- 2.0
- Export Control Classification Number (ECCN)
- 5A992C
- Market segment
- Desktop
- Bus speed
- 8 GT/s
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Intel® Turbo Boost Technology
Higher Performance When You Need It Most Intel® Turbo Boost Technology 2.01 accelerates processor and graphics performance by increasing the operating frequency when operating below specification limits. The maximum frequency varies depending on workload, hardware, software, and overall system configuration.
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| Technical details | |
|---|---|
| Product type | Processor |
| Target market | Gaming, Content Creation |
| Launch date | Q2'20 |
| Status | Launched |
| Maximum memory | 128 GB |
| Bus speed | 8 GT/s |
| Processor | |
| Processor family | 10th gen Intel® Core™ i9 |
| Processor cores | 10 |
| Processor socket | LGA 1200 (Socket H5) |
| Component for | PC |
| Processor lithography | 14 nm |
| Box |  |
| Cooler included |  |
| Processor manufacturer | Intel |
| Processor base frequency | 2.8 GHz |
| Processor model | i9-10900F |
| Processor threads | 20 |
| System bus rate | 8 GT/s |
| Processor operating modes | 64-bit |
| Processor cache | 20480 KB |
| Processor cache type | Smart Cache |
| Thermal Design Power (TDP) | 65 W |
| Processor boost frequency | 5.2 GHz |
| Memory bandwidth supported by processor (max) | 45.8 GB/s |
| Processor codename | Comet Lake |
| Processor ARK ID | 199329 |
| Generation | 10th Generation |
| Memory | |
| Memory channels | Dual-channel |
| Maximum internal memory supported by processor | 128 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| ECC | |
| Weight & dimensions | |
| Processor package size | 37.5mm x 37.5mm |
| Operational conditions | |
| Tjunction | 100 °C |
| Packaging data | |
| Package type | Retail box |
| Other features | |
| Maximum internal memory | 128 GB |
| Graphics | |
| On-board graphics adapter | |
| Discrete graphics adapter | |
| On-board graphics adapter model | Not available |
| Discrete graphics adapter model | Not available |
| Processor special features | |
| Intel® Hyper Threading Technology (Intel® HT Technology) | |
| Intel® Identity Protection Technology (Intel® IPT) | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® AES New Instructions (Intel® AES-NI) | |
| Enhanced Intel SpeedStep Technology | |
| Intel Trusted Execution Technology | |
| Intel® Thermal Velocity Boost | |
| Intel® Turbo Boost Max Technology 3.0 frequency | 5.1 GHz |
| Intel® Turbo Boost Technology 2.0 frequency | 5 GHz |
| Intel® Transactional Synchronization Extensions | |
| Intel® Thermal Velocity Boost Temperature | 70 °C |
| Intel® Thermal Velocity Boost Frequency | 5.2 GHz |
| Intel VT-x with Extended Page Tables (EPT) | |
| Intel® Secure Key | |
| Intel Stable Image Platform Program (SIPP) | |
| Intel® OS Guard | |
| Intel Software Guard Extensions (Intel SGX) | |
| Intel 64 | |
| Intel Virtualization Technology (VT-x) | |
| Intel Virtualization Technology for Directed I/O (VT-d) | |
| Intel Turbo Boost Max Technology 3.0 | |
| Intel® Optane™ Memory Ready | |
| Intel® Boot Guard | |
| Intel® vPro™ Platform Eligibility | |
| Features | |
| Execute Disable Bit | |
| Idle States | |
| Thermal Monitoring Technologies | |
| Maximum number of PCI Express lanes | 16 |
| PCI Express slots version | 3.0 |
| PCI Express configurations | 1x16,2x8,1x8+2x4 |
| Supported instruction sets | SSE4.1,SSE4.2,AVX 2.0 |
| Scalability | 1S |
| CPU configuration (max) | 1 |
| Embedded options available | |
| Thermal solution specification | PCG 2015C |
| PCI Express CEM revision | 3.0 |
| Market segment | Desktop |
| Harmonized System (HS) code | 8542310001 |
| Export Control Classification Number (ECCN) | 5A992C |
| Tavaraluokituksen automaattinen seurantajärjestelmä (CCATS) | G077159 |
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